patent/US-2012252170-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012252170-A1

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classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
filingDate	2012-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab2e5e34c38f683b10e63d41198974fc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6cc093133b91e510697b6df34c8e4c2e
publicationDate	2012-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2012252170-A1
titleOfInvention	Packaged electronic devices having die attach regions with selective thin dielectric layer
abstract	A method for forming a packaged electronic device including a package substrate having a top substrate surface including a die attach region including at least one land pad thereon and a first dielectric layer positioned lateral to the land pad and a non-die attach region. A second dielectric layer is formed on the top substrate surface of the package substrate. An IC die which is mounted to the top substrate surface of the package substrate. An underfill layer is formed between the IC die and the die attach region.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10157821-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018350724-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8816491-B2
priorityDate	2009-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978

Total number of triples: 71.