patent/KR-20010085617-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20010085617-A

Outgoing Links

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filingDate	2001-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e385fa7caacb69b7e35beb72863057f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36e313cc9ddfbcd456046293522390a2
publicationDate	2001-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	KR-20010085617-A
titleOfInvention	Semiconductor device and method of manufacturing the same, Circuit board, and Electronic instrument
abstract	In the method of manufacturing a semiconductor device of the present invention, a step of forming a bump on the first surface side of a semiconductor chip and exposing the conductive layer to a concave position from the second surface on the second surface side opposite to the first surface. And forming an exposed portion and a bump from the hole of the conductive layer.
priorityDate	2000-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID25516 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID450502002

Total number of triples: 76.