| abstract |
A semiconductor package device includes a die, a dielectric layer, a plurality of conductive pillars, and a package body. The die has an active surface, a back surface opposite the active surface, and side surfaces extending between the active surface and the back surface. The dielectric layer is on the active surface of the die, has a top surface and defines a plurality of openings. Each conductive pillar is disposed in a corresponding opening of the plurality of openings in the dielectric layer. Each conductive pillar is electrically connected to the die. Each conductive pillar has a top surface. The top surface of each conductive pillar is lower than the top surface of the dielectric layer. The package body encapsulates the back surface and the side surface of the die. |