http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101932727-B1

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filingDate 2012-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2018-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber KR-101932727-B1
titleOfInvention Bump structure, semiconductor package having the bump structure, and method of manufacturing the bump structure
abstract The bump structure includes a first bump and a second bump. The first bump being disposed on a connection pad of the substrate and extending from the connection pad and having a bottom having a first width, a central portion having a second width less than the first width, and a third width greater than the second width Respectively. The second bumps are disposed on top of the first bumps.
priorityDate 2012-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 55.