patent/JP-6986074-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6986074-B2

Outgoing Links

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classificationIPCInventive	http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L25-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
filingDate	2017-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2021-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate	2021-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	JP-6986074-B2
titleOfInvention	Laminated semiconductor die assembly with high efficiency thermal path and mold underfill
priorityDate	2016-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341

Total number of triples: 56.