abstract |
Provided are a photosensitive resin composition excellent in heat resistance, developability and curability, a laminate using such a photosensitive resin composition, a method for producing a semiconductor device, and a semiconductor device. A photosensitive resin composition comprising a polymer containing a repeating unit derived from an acid group-containing maleimide, a crosslinking agent, a photopolymerization initiator, and a thermal polymerization initiator. It is preferable that the polymer further contains a repeating unit derived from a vinyl compound. [Selection figure] None |