| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J135-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate |
2008-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3dc77d279af7111f328513cc9a13a785
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf82d4c8d861073cabb801ca31ca7040
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95af9050666b7013665e0a1d5c413ccb |
| publicationDate |
2010-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2010024427-A |
| titleOfInvention |
Adhesive composition, film adhesive, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device, and method for manufacturing semiconductor device |
| abstract |
PROBLEM TO BE SOLVED: To provide an adhesive composition excellent in film forming property that can be used for bonding a semiconductor element and realizing a film adhesive having both low temperature sticking property and reflow resistance, and a film shape using the same. To provide an adhesive, an adhesive sheet, a semiconductor wafer with an adhesive layer, a semiconductor device, and a method for manufacturing the semiconductor device. An adhesive composition of the present invention is an adhesive composition used for adhering a semiconductor element to an adherend, and (A) one or more maleimide compounds and one or more monofunctional compounds. A thermoplastic polymer obtained by copolymerizing a vinyl compound and (B) a thermosetting resin are contained. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011171586-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022004849-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015147028-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015189883-A |
| priorityDate |
2008-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |