| abstract |
Provided are: a photosensitive resin composition having excellent heat resistance, developability and curability; a laminate produced using the photosensitive resin composition; a method for manufacturing a semiconductor device; and a semiconductor device.nA photosensitive resin composition comprising: a polymer containing a repeating unit derived from an acid-group-containing maleimide; a cross-linking agent; a photopolymerization initiator; and a thermopolymerization initiator. It is preferred that the polymer further contains a repeating unit derived from a vinyl compound. |