| abstract |
Provided are a semiconductor device, a semiconductor package, and an electronic device. The electronic device includes a first semiconductor package on a circuit board. A second semiconductor package spaced apart from the first semiconductor package is provided on the circuit board. An insulating electromagnetic shielding structure is provided on the top and side surfaces of the first semiconductor package. A conductive electromagnetic shielding structure is provided on the circuit board to cover the first and second semiconductor packages and the insulating electromagnetic shielding structure. |