| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_960186b7b7426a6e5a7169f24b1d418d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-291
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-552 |
| filingDate |
2019-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e97b1b61a172ea6ee7ef4d80e4d9aec9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3208a3f3df6e48bef42f7ded8b74975b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7d490f5596207494c2400244ed57eac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_803ff8b2b25af9991341982af425663b |
| publicationDate |
2021-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20210046480-A |
| titleOfInvention |
Semiconductor package |
| abstract |
A semiconductor package is disclosed. According to an embodiment of the present invention, a substrate; A semiconductor device mounted on the substrate; A cover layer surrounding at least a portion of the substrate and the semiconductor device; And an outer shielding layer provided on the outer surface of the semiconductor package and including a boron nitride and a conductive film formed on the surface of the boron nitride. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023023257-A3 |
| priorityDate |
2019-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |