| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06517
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0557
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12 |
| filingDate |
2011-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2011-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2011-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101069441-B1 |
| titleOfInvention |
Semiconductor package |
| abstract |
The present invention relates to a semiconductor package, and even when a plurality of semiconductor dies are stacked, it is possible to select each semiconductor die by stacking the same semiconductor die without configuring the redistribution layer of each semiconductor die differently. To this end, the present invention includes a substrate having a plurality of die selection wiring patterns and signal wiring patterns; A first semiconductor die electrically connected to the substrate and having a die selection through electrode and a signal through electrode; And a second semiconductor die electrically connected to the first semiconductor die and having the same structure as the first die, wherein the die selection through electrode comprises a semiconductor package including an enable through electrode and at least one dummy through electrode. It starts. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11127687-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11756935-B2 |
| priorityDate |
2011-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |