| abstract |
The invention relates to a stack of semiconductor chips and to a method for producing an associated semiconductor device. In one aspect of the invention, the stack includes a first chip (10), a second chip (20) stacked over the first chip, conductive bumps (26) extending between an upper surface of the first chip and the underside of the second chip, and a homogeneous integral underfill material (28) inserted between the first chip and the second chip encapsulating the conductive bumps and extending along sidewalls of the second chip. A molding material (29) is provided on outside surfaces of the underfill material over the top of the first chip, wherein the molding material is separated from sidewalls of the second chip by the underfill material such that the molding material does not contact sidewalls of the second chip. Use z. In multichip pack packages for small size electronic devices or portable electronic devices. |