patent/KR-20130124637-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20130124637-A

Outgoing Links

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filingDate	2012-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f72e97df622a9c2f2ad75238e3a8e5fb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e4aa47015e73ff28dfce946af014e211 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a996fb0cfcda50996b764c48194d8a52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_311ff8278e35d5e5bf56568fe57fd495
publicationDate	2013-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	KR-20130124637-A
titleOfInvention	Bump structure, semiconductor package having same and manufacturing method thereof
abstract	The bump structure includes a first bump and a second bump. The first bump is disposed on a connection pad of a substrate, and extends from the connection pad and has a lower portion having a first width, a central portion having a second width smaller than the first width, and a third width greater than the second width. It has a top having. The second bump is disposed on top of the first bump.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20190112352-A
priorityDate	2012-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 62.