| abstract |
The present invention provides an underfill material which can realize a wide package tolerance, and a method of manufacturing a semiconductor device using the same. The present invention uses an underfill material (20) containing an epoxy resin, an acid anhydride, an acrylic resin, and an organic peroxide, and the lowest melting when measuring the melt viscosity at a temperature increase rate of 5 ° C / min or more and 50 ° C / min or less. The viscosity reaches a temperature of 100 ° C or more and 150 ° C or less, and the lowest melt viscosity is 100 Pa. s above 5000Pa. s below. The change of the minimum melt viscosity to temperature at the time of measurement under different heating temperature conditions is small, so even if the temperature distribution during thermocompression bonding is not strictly controlled, a void-free structure and good weldability can be realized, and a wide structure can be realized. Install tolerance. |