| abstract |
One embodiment provides a substrate, electrolessly depositing a barrier metal over at least portions of the substrate, and substantially gold-free wetting with solder wettability on the barrier metal using a wet chemical such as electroless deposition And depositing a layer on the substrate. One embodiment includes a metallization stack. The metallization stack includes a substantially gold-free wetting layer deposited on the electrolessly deposited barrier metal and the barrier metal, and the wetting layer is wettable by the solder. |