patent/US-9087754-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9087754-B2

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filingDate	2014-10-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2015-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a2aa982c168ba61627bcb3ff736caef http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7171184fadcec7657c870a63a74444c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a82fb403e2f3284fb17af64240866c0f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc699208ce3ea0980913d17ba7073df2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07209388ffdc77e841bfa9725d55a24e
publicationDate	2015-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-9087754-B2
titleOfInvention	Structures and methods for improving solder bump connections in semiconductor devices
abstract	Structures with improved solder bump connections and methods of fabricating such structures are provided herein. The structure includes a via formed in a dielectric layer to expose a contact pad and a capture pad formed in the via and over the dielectric layer. The capture pad has openings over the dielectric layer to form segmented features. The solder bump is deposited on the capture pad and the openings over the dielectric layer.
priorityDate	2008-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 81.