| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6af1aac0717028a45913e80d9e05fad8 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3841
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-2064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11464
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11462
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13025 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49894
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-492 |
| filingDate |
2015-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87d5ab18d79188f1b61c627b7ab331b0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1c79150409aee5a8bd831db41f1644f |
| publicationDate |
2016-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201643973-A |
| titleOfInvention |
Substrate structure and its preparation method and conductive structure |
| abstract |
A substrate structure includes: a substrate body having a plurality of electrical contact pads; an insulating layer formed on the substrate body; a conductive via formed in the insulating layer and electrically connected to the electrical contact pad; a circuit layer disposed on the conductive via hole in the insulating layer, and a conductive pillar formed on the insulating layer and disposed on the circuit layer and covering the conductive via hole to make the conductive via hole, the circuit layer and the conductive pillar The utility model is an integral shaper, wherein the width of the circuit layer is greater than the width of the conductive via, and the width of the conductive pillar is greater than the width of the circuit layer for covering the ultra-fine wafer or the fine-pitch electrical contact pads. Crystalelectric connection. |
| priorityDate |
2015-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |