abstract |
Provided is a thermosetting resin composition capable of manufacturing a semiconductor device with high connection reliability while ensuring the availability of material of a member by mitigating the difference in thermal response behavior between the semiconductor element and the adherend, and a method of manufacturing a semiconductor device using the same. The present invention is a thermosetting resin composition for the production of a semiconductor device comprising an epoxy resin and a novolac phenolic resin having a hydroxyl equivalent of 200 g / eq or more. The novolak type phenolic resin preferably includes a structure represented by the following structural formula. (Wherein n is an integer of 0 to 12) |