| abstract |
The present invention provides a semiconductor device capable of suppressing the occurrence of poor electrical connection when mounted on an external substrate. The semiconductor device includes: a semiconductor substrate; a plurality of first bipolar transistors, which are provided on the first main surface side of the semiconductor substrate, and have a first between the emitter layer and the emitter electrode in a direction perpendicular to the first main surface A height; at least one or more second bipolar transistors, disposed on the first main surface side of the semiconductor substrate, in a direction perpendicular to the first main surface, between the emitter layer and the emitter electrode A second height with a high height; and a first bump, which are arranged over a plurality of first bipolar transistors and at least one second bipolar transistor. |