patent/TW-201417223-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201417223-A

Outgoing Links

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filingDate	2013-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98b8e93d8084e5a4b3938db2bd5dd7ca http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_65d0b7b533ce566ac810f8c2d76b71eb http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23cf89a617d5896efdfbf7da34a7a35e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4a5f2eb1a20ee17a0dddbf9a5bc6100a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc5d13bbfac1790c14d85bb6ea1ccf5b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c8f87440cff1efb95eb38968152e379
publicationDate	2014-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	TW-201417223-A
titleOfInvention	Packaging method of semiconductor device, packaging device and manufacturing method thereof
abstract	The present disclosure provides a package device and a method of fabricating the same, and a package method for providing a semiconductor device. In one embodiment, the packaging device includes a substrate including an integrated circuit mounting region and an element for preventing flow of the underfill material disposed around the integrated circuit mounting region.
isCitedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10529637-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10804178-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11424173-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I673833-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I697090-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I624013-B
priorityDate	2012-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate	Subject
isDiscussedBy	http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID414004986

Total number of triples: 64.