| abstract |
The invention relates to a method for producing chip stacks (31) with the following method sequence: applying an especially dielectric and/or photostructurable base layer (20) to one carrier side (15) of a carrier (10) which on its carrier side (15) is provided with an adhesively acting adhesion zone (14) and a less adhesively acting support zone (11), the base layer (20) being applied largely over the entire surface at least to the support zone (11), building up the chip stacks (31) on the base layer (20), potting of the chip stacks (31), detaching the carrier (10) from the base layer (20). Moreover the invention relates to a carrier for executing this method. |