| abstract |
A two-sided access (TSA) extended or embedded wafer-levered ball grid array (eWLB) is provided which makes it possible to easily access electrical contact pads located on both the front and back surfaces of the eWLB chip (s) Pack are arranged. When the IC chip wafers are fabricated, metal stamps are formed in the IC chip wafer in contact with the back surfaces of the IC chips. When the IC chips are subsequently restored to an artificial wafer, portions of the metal stamps are exposed through the mold of the artificial wafer. When the artificial wafer is sawn to singularize the TSA eWLB packages and the packages are mounted on PCBs, each electrical contact pad disposed on the back surface of the IC chip can be accessed via the respective metal die of the IC chip. |