| abstract |
The present invention relates to a package and a method for manufacturing the same, comprising: a first package having a first surface and a second surface, the first package including a first printed circuit board on which a first die is mounted having through silicon vias on the first surface; And a second package having a first surface and a second surface, the second package including a second printed circuit board having a second die mounted thereon with through silicon vias on the first surface; A first external connection terminal electrically connecting the first surface of the printed circuit board and the first surface of the second printed circuit board, and a first connection bump electrically connecting the first die and the second die to each die. Since the power signal is applied independently, the effect of improving the power stability of each die can be expected. |