| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5070eebb028c9c89c2a8d6c1c88f90ce |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-17181 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3733
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28F21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3737
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F28F21-02 |
| filingDate |
2019-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_08a3eb981ea05b7c75c513dc71659dc0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a760794b7d2698599a1f25ba80e39c7c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd0e2641032dab4b3d9084c5240f68f6 |
| publicationDate |
2019-07-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2019221495-A1 |
| titleOfInvention |
Method and Apparatus of Operating a Compressible Thermal Interface |
| abstract |
A thermal electrical (TE) interface comprises a primary fiber thermal interface (FTI) having a first side configured to contact a heatsink, and a second side. The primary fiber thermal interface has a thickness ranging from 0.3 mm to 4 mm. A secondary fiber thermal interface (FTI) has a first side configured to contact the second side of the primary FTI, a second side configured to contact circuit components to dissipate heat from the circuit components through the first side of the primary FTI. The secondary fiber thermal interface has a thickness equal to or greater than the primary FTI. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11335622-B2 |
| priorityDate |
2018-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |