| abstract |
【Task】 In one embodiment, the substrate has wettability using a step of preparing a substrate, a step of electroless plating a barrier metal on at least a portion of the substrate, and wet chemistry such as electroless plating. Plating a wet layer substantially free of gold on a barrier metal. In one embodiment, an electronic device comprising a metallization stack is disclosed. The metallization stack comprises an electrolessly plated barrier metal and a substantially gold free wetting layer plated on the barrier metal, the wetting layer being wettable by solder. [Selection] Figure 2 |