patent/KR-20120098844-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20120098844-A

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filingDate	2010-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51a509f2edc97d4c75ab3e3f52416695 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e28a19ee556c73e61861f3208aeeb503 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3bd98c199c372594f13915cc44a12d11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf1d3745a0b28384b6bb22d9b91439c3
publicationDate	2012-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	KR-20120098844-A
titleOfInvention	Semiconductor package with embedded die and manufacturing method thereof
abstract	Embodiments of the present invention describe a semiconductor package with an embedded die. The semiconductor package includes a coreless substrate that includes an embedded die. The semiconductor package provides die stacking or package stacking functionality. Embodiments of the present invention also describe a method of manufacturing a semiconductor package that minimizes assembly costs.
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type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 135.