| abstract |
The present invention provides a semiconductor device capable of suppressing the occurrence of electrical connection failure when mounted on an external substrate. The semiconductor device has: a semiconductor substrate; a plurality of first bipolar transistors are provided on the first main surface side of the semiconductor substrate, and in a direction perpendicular to the first main surface, there is a first bipolar transistor between the emitter layer and the emitter electrode. A height; at least one second bipolar transistor is arranged on the side of the first main surface of the semiconductor substrate, and in a direction perpendicular to the first main surface, between the emitter layer and the emitter electrode, there is more than the first A high second height; and the first bumps are arranged all over a plurality of first bipolar transistors and at least one or more second bipolar transistors. |