| abstract |
An integrated passive component in a stacked integrated circuit package is described. In one embodiment, an apparatus includes a substrate, a first die coupled to the substrate on the substrate, the first die having a processing core coupled to the substrate and receiving power, the processing core having a first die on a first die, A second die connected to the die - a first die coupled to the power supply circuit for supplying power to the process core, and a passive device attached to the first die and connected to the power supply circuit. |