| abstract |
A semiconductor assembly (10) comprises a package (20), which in turn comprises at least one substrate (30), a first die (40) stacked onto the substrate, at least one further die (50) stacked onto the first die, at least one heat spreader (60) in the package, and TSV:s (70) extending through the stacked dies. The ends (71) of the TSV:s are exposed at the further die. |