| abstract |
The present invention provides a kind of wafer encapsulation body, wafer scale cell array and its manufacture method, the wafer scale cell array includes semiconductor wafer, at least two chips and a bearing bed with arranged adjacent, respectively the chip has a upper surface and a lower surface, and an at least electronic component is included in the upper surface, the bearing bed is covered in the upper surface of the respectively chip；And at least extension cord protection block, it is configured under the bearing bed and between this at least two chips, the thickness of the thickness less than the chip of extension cord protection block, wherein, extension cord protection block inside has an at least extension cord.There is the present invention processing procedure to simplify and effect with low cost. |