| abstract |
The present invention discloses a method of fabricating a multi-die assembly comprising a wafer segment having no integrated circuitry thereon having a plurality of vertically stacked crystals electrically interconnected by conductive vias Granules; resulting multi-die components; and semiconductor devices comprising such multi-die components. The wafer segments can act as a heat sink to enhance thermal transfer from the stacked grains in the resulting multi-die assembly. The die stacks are fabricated at the wafer level on a substrate wafer, and the wafer segments and the die stacks are singulated from the substrate wafer after at least peripheral encapsulation. |