| abstract |
Embodiments of the present invention provide a package-on-package arrangement comprising a first package 804, 904 comprising a substrate layer 116 comprising an upper side 117a and an upper lower side 117b, Where the top side of the substrate layer forms a generally flat surface 117a and the first die 118 is bonded to the bottom side of the substrate layer. The arrangement also includes a second package 802, 902 that includes a plurality of rows of solder balls 806, 906 and at least one of active components or one or both of passive components 810, 910, 920 . The second package is affixed to the generally flat surface on the top side of the substrate layer of the first package through the solder balls of the plurality of rows. The active and / or passive components 810, 910, 920 are attached to a generally flat surface on the top side of the substrate layer of the first package. |