Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_045829eeb980c895e942ffe883cf7ce2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f801e2dc40132ece848d9725e1183aa3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ed7bda5d2c01f9fbb3df0d2437d3042a http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6ee188aebaa36dd59049529e129ecf86 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01072 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-94 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0557 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-30105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-94 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-80 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44 |
filingDate |
2011-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2013-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d39b7458e632a7e6437eb27fe24c5acf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d900c78aa1617f4b41a8fa2843641aac http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1b8f3f5c6750c2e564583eff961e6b82 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5eccddb854ace2952cf5df89d1aa43db |
publicationDate |
2013-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8354737-B2 |
titleOfInvention |
Small area, robust silicon via structure and process |
abstract |
A semiconductor structure includes: at least one silicon surface wherein the surface can be a substrate, wafer or other device. The structure further includes at least one electronic circuit formed on each side of the at least one surface; and at least one conductive high aspect ratio through silicon via running through the at least one surface. Each through silicon via is fabricated from at least one etch step and includes: at least one thermal oxide dielectric for coating at least some of a sidewall of the through silicon via for a later etch stop in fabrication of the through silicon via. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11127654-B2 |
priorityDate |
2007-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |