| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76829
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-14519 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3733
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-367
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4882
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3677
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3731
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3736
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76801
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-367 |
| filingDate |
2017-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2022-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-102473615-B1 |
| titleOfInvention |
Integrated Circuit Nanoparticle Thermal Routing Structures in the Interconnection Area |
| abstract |
In the illustrated examples, the integrated circuit 100 has a substrate 102 and an interconnect area 106 disposed on the substrate 102 . The interconnection area 106 has interconnection levels. Integrated circuit 100 includes a column routing structure 130 within interconnect area 106 . Column routing structure 130 extends over a non-entire portion of integrated circuit 100 at interconnect area 106 . The thermal routing structure 130 includes an agglomerated nanoparticle film in which adjacent nanoparticles agglomerate with each other. The thermal routing structure 130 has a higher thermal conductivity than the dielectric material that touches the thermal routing structure 130 . Aggregated nanoparticle films are formed by methods involving an additive process. |
| priorityDate |
2016-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |