| abstract |
The heat dissipation of the laminate including the electronic component group is increased and the cooling efficiency is increased. The electronic device (1) includes an electronic component (21) group, and includes an Nth layer having a gap (25) between adjacent electronic components (21). The electronic device (1) further includes an electronic component (21) group stacked on the Nth layer and connected to the Nth layer electronic component (21) group, and the Nth layer is disposed between the adjacent electronic components (21). It includes the (N + 1) th layer having a gap (25) that partially overlaps the gap (25) of the layer. A gap (25) between the Nth layer and the (N + 1) th layer partially overlaps to form a blow-through (24) communicating between the Nth layer and the (N + 1) th layer. By the gap (25) between the electronic components (21) of each layer and the blow-through (24) extending over a plurality of layers, the heat dissipation of the laminate (20) including the electronic component (21) group is enhanced and the cooling efficiency is enhanced. |