| abstract |
The invention relates to a method for producing electrical contact connections in a semiconductor wafer (1)), wherein the wafer has an upper side, a lower side, at least one terminal contact (25) on the upper side and on the upper side (14) at least one optically active component includes, where - The wafer is thinned before dicing, and where - At least one contact channel is produced in the thinned wafer, which comprises a hole (17), which - From the bottom to the terminal contact (25) on the top reaches, and wherein the hole (17) - Provided with an insulator for electrical insulation of the hole (17) to the wafer and - coated with a metal. |