| abstract |
Electronic device comprising: a circuit substrate (100a) including a ground pad (GPa); a first semiconductor package (PKGA1) arranged on the circuit substrate (100a); a second semiconductor package (PKGB1) disposed remotely from the first semiconductor package (PKGA1) on the circuit substrate (100a); an insulating electromagnetic shielding structure (ESS1_1) arranged on top and side surfaces of the first semiconductor package (PKGA1); and a conductive electromagnetic shielding structure (CS1) arranged on the circuit substrate (100a) and covering the first and second semiconductor assemblies (PKGA1 and PKGB1) and the insulating electromagnetic shielding structure (ESS1_1), wherein a free space (AS1) is formed between the insulating electromagnetic shielding structure (ESS1_1) and the conductive electromagnetic shielding structure (CS1), and wherein the conductive electromagnetic shielding structure (CS1) is grounded via the ground pad (GPa) of the circuit substrate (100a), wherein the insulating electromagnetic shielding structure (ESS1_1) contains a first polarizer (ESS1_1a) with a first transmission axis, and a second polarizer (ESS1_1b) with a second transmission axis perpendicular to the first transmission axis of the first polarizer (ESS1_1a), wherein the first polarizer (ESS1_1a) includes a first base and first conductive patterns, which are lines arranged in a first longitudinal direction on the first base, wherein the second polarizer (ESS1_1b) includes a second base and second conductive patterns that are lines arranged in a second longitudinal direction perpendicular to the first longitudinal direction on the first base. |