patent/US-2010105169-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010105169-A1

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filingDate	2009-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b777b000b154875aca5836a933e73787 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_692d46ccd9eac55ba9d0206c8e84a14a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_49e5138c7713285fa807b568c70fc9a3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e6419861f925dac095b2e67c1a7fee9e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b08659ee4678ea8828b96f3d79625e9
publicationDate	2010-04-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2010105169-A1
titleOfInvention	Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodes
abstract	A semiconductor device includes a semiconductor substrate and a via electrode. The via electrode has a first portion on the substrate and extends towards the substrate and has a plurality of spikes that extends from the first portion into the substrate, each of the spikes being spaced apart form one another.
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Incoming Links

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Total number of triples: 117.