| abstract |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition capable of manufacturing a semiconductor device with high connection reliability while ensuring the availability of a material of a member by relaxing a difference in thermal response behavior between a semiconductor element and an adherend. And a method of manufacturing a semiconductor device using the same. The present invention is a thermosetting resin composition for manufacturing a semiconductor device, comprising an epoxy resin and a novolac-type phenol resin having a hydroxyl group equivalent of 200 g / eq or more. The novolac type phenolic resin preferably includes a structure represented by the following structural formula. [Selection] Figure 2F |