| abstract |
A semiconductor device includes: a substrate having a first surface and a second surface opposite to each other; a plurality of through electrodes penetrating the substrate and extending from the first surface to the second surface a front side bump disposed on the first surface and connected to the odd number of through electrodes among the plurality of through electrodes; and a back side bump disposed on the second surface and connected to the plurality of through electrodes The even number penetrates the electrode. The invention also provides related semiconductor packages, fabrication methods, electronic systems, and memory cards. |