http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-485
Outgoing Links
| Predicate | Object |
|---|---|
| concordantIPC | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-485 |
| level | 10^^<http://www.w3.org/2001/XMLSchema#integer> |
| symbol | H01L23/485 |
| modified | 2015-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| title | Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts |
| type | http://data.epo.org/linked-data/def/cpc/SubGroup |
| broader | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-482 |
Incoming Links
Total number of triples: 10000.