| abstract |
The present disclosure relates to a semiconductor device comprising a plurality of insulating layers, a plurality of wiring layers disposed in the plurality of insulating layers, and a plurality of connecting via layers penetrating the plurality of insulating layers and electrically connecting the plurality of wiring layers, A frame having a recessed portion in which a starter layer is disposed; A semiconductor chip having a connection pad, an active surface on which the connection pad is disposed, and an inactive surface opposite to the active surface, the inactive surface being connected to the stopper layer; A first metal bump disposed on a connection pad of the semiconductor chip; A second metal bump disposed on the uppermost wiring layer among the plurality of wiring layers; A seal member covering at least a portion of each of the frame, the semiconductor chip, and the first and second metal bumps, respectively, and filling at least a part of the recessed portion; And a re-wiring layer disposed on the active surface of the frame and the semiconductor chip, the re-wiring layer being electrically connected to the connection pad and the uppermost wiring layer through the first and second metal bumps; To a fan-out semiconductor package. |