patent/TW-I696226-B

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I696226-B

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filingDate	2018-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2020-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13615357da42e36fc9c03e544f5835c3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_46f975d3628e69cc18e0bbceb4e897ea http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7eb213879a3d808876e13769e95d55d7
publicationDate	2020-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	TW-I696226-B
titleOfInvention	Semiconductor device and method of manufacture
abstract	An integrated fan out package is utilized in which the dielectric materials of different redistribution layers are utilized to integrate the integrated fan out package process flows with other package applications. In some embodiments an Ajinomoto or prepreg material is utilized as the dielectric in at least some of the overlying redistribution layers.
priorityDate	2018-03-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 75.