Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b2d32a1324eb3a240649ffee8d475d63 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0556 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0391 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11452 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05573 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02206 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-03019 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0219 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-4236 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05541 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02126 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13018 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1146 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02215 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-10135 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05583 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0217 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0554 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7682 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-41725 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5222 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76885 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-485 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-417 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 |
filingDate |
2019-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a7809be6571019f01cf0bbc1838f694 |
publicationDate |
2021-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2021134743-A1 |
titleOfInvention |
Semiconductor device with spacer over bonding pad |
abstract |
The present application provides a semiconductor device. The semiconductor device includes a bonding pad disposed over a semiconductor substrate; a first spacer disposed over a top surface of the bonding pad; a second spacer disposed over a sidewall of the bonding pad; a dielectric layer between the bonding pad and the semiconductor substrate. The dielectric layer includes silicon-rich oxide; and a conductive bump disposed over the first passivation layer. The conductive bump is electrically connected to a source/drain (S/D) region in the semiconductor substrate through the bonding pad |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11469202-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022189818-A1 |
priorityDate |
2019-11-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |