| abstract |
Onensolder contactnhas a brazing material, a UBM with a bendable double layer,nconsisting of a first layer of material, which is a first materialnand a second material layer comprising a second materialnand between the solder material and the first material layernis arranged on. Here shows the solder material, the first layer of materialn1 and the second material layer of a correspondingly definednStrengthnin terms of a metallurgical reaction and trainingnan intermetallic compound of the second material andnthe solder material predetermined properties. These propertiesncharacterized by the fact that the presence of the second material metallurgicalnReactions of the first material with the solder in the entire temperature rangenthe connection and the operation of the constructed electronic component preventsnthe reliabilitynthe overall connection detrimentalnare. |