| abstract |
A structure includes a passivation layer formed on a semiconductor substrate, a connection pad surrounded by the passivation layer, a redistribution layer which is formed on the passivation layer and is connected to the connection pad, a bump which is formed on the redistribution layer and is connected to the redistribution layer, and a molding compound layer formed on the redistribution layer. The molding compound layer includes a flat part and a protruding part. The lower part of the bump is filled in the flat part of the molding compound layer. The middle part is surrounded by the protruding part of the molding compound layer. |