| abstract |
One method includes forming a reconstructed wafer comprising encapsulating a device die in an encapsulant, forming a dielectric layer over the device die and encapsulant, forming a plurality of redistribution lines extending into the dielectric layer so as to be electrically connected to the device die, and forming a metal ring in a common process for forming the plurality of redistribution lines. The metal ring surrounds the plurality of redistribution lines and the metal ring extends in scribe lines on the reconstructed wafer. A die sawing process is performed along scribe lines on the reconstructed wafer in order to separate a package from the reconstructed wafer. The package includes the device die and at least a portion of the metal ring. |