| abstract |
Electric contacts of aluminum (including aluminum alloys and other conductive materials having similar melting points) are made in vias, through holes, or trenches of multilayer integrated circuits having aspect ratios of 1 or more. Intended to be crowded. The carrier layer preferably comprises a layer formed by ionizing a sputter deposited material bundle, partially reacting the bundle with a gas, and depositing the resulting material on a substrate. . The aforementioned contacts can be formed in vias, through holes, and trenches with aspect ratios of at least about 5: 1, and about 12: 1. It is also possible to fill apertures with aspect ratios up to. In addition to allowing the formation of high aspect ratio conductive contacts, the carrier layer also functions as a barrier layer, which prevents migration of aluminum into the surrounding substrate material that cooperates with the electrical contacts. . |