| abstract |
A method of manufacturing a semiconductor device, the method comprising: providing a plurality of first semiconductor dies; Depositing an encapsulant over a first surface of the first semiconductor die and around the first semiconductor die; Forming an insulating layer over said encapsulant and over a second surface of a first semiconductor die facing said first surface; Forming a first conductive layer over the insulating layer; And disposing a second semiconductor die over the first semiconductor die and electrically connecting the first conductive layer to the first conductive layer. |