| abstract |
A fan-out semiconductor package according to an embodiment of the present invention includes a first connecting member having a through-hole, first and second semiconductor chips disposed in the through-hole, and first and second semiconductor chips A second connecting member disposed on at least one side of the first and second semiconductor chips and including a re-wiring layer electrically connected to the first and second semiconductor chips, and a second connecting member disposed on at least one side of the first and second semiconductor chips, And at least part of which is filled with an insulating material. |